Dual Experimental Approach for Thermal Impacts on Electromagnetic Behavior of Electronic Circuit Board Configurations

Some effects of physical parameters, such as temperature, on electromagnetic emission or susceptibility of electronic circuit boards are nonnegligible and can be enforced by new integrated complex electronic structures. This paper describes experimental improvements proposed on near-field and radiated-mode test setups, including the temperature parameter. New experimental investigations and methodology are driven to estimate the real external thermal impacts on electromagnetic behavior and compliance. With pertinent characterization results, a review of wideband frequency modifications of electromagnetic compatibility (EMC) responses on electronic configurations with active digital devices and a printed circuit board (PCB) wire network is presented and analyzed.