Bonding of silicon with filled and unfilled polymers based on black silicon

Author

Stubenrauch, M. ; Fischer, M. ; Kremin, C. ; Hoffmann, M. ; Müller, J.

Author_Institution

Dept. for Micromechanical Syst., Ilmenau

Volume

2

Issue

1

fYear

2007

fDate

3/1/2007 12:00:00 AM

Firstpage

6

Lastpage

8

Abstract

A bonding method for silicon wafers with unfilled and filled polymer components using `Black Silicon´ is presented. The working principle is an interconnection of `Black Silicon´ surfaces with ductile materials. Needles of nanostructured `Black Silicon´ with their increased surface and undercut features penetrate the polymer when applying pressure. Plastic deformations of the polymer lead to a permanent bond. The retention force exceeds 1000 N/cm² as experiments with polypropylene and low temperature co-fired ceramic tapes (polymer filled with ceramic) show. The application areas are smart packaging, fluidic interconnects for microsystems, electronic assembly and hybrid polymer-ceramic silicon systems

Keywords

ceramics; elemental semiconductors; filled polymers; integrated circuit interconnections; integrated circuit packaging; microfluidics; nanostructured materials; plastic deformation; silicon; wafer bonding; Si; bonding method; co-fired ceramic tapes; ductile materials; electronic assembly; filled polymer; fluidic interconnects; hybrid polymer-ceramic silicon systems; nanostructured black silicon; plastic deformations; polypropylene; retention force; silicon wafers; smart packaging;

fLanguage

English

Journal_Title

Micro & Nano Letters, IET

Publisher

iet

ISSN

1750-0443

Type

jour

DOI

10.1049/mnl:20065064

Filename

4154072