DocumentCode :
772747
Title :
A new grounded lamination gate (GLG) for diminished fringe-capacitance effects in high-/spl kappa/ gate-dielectric MOSFETs
Author :
Kumar, M. Jagadesh ; Venkataraman, Vivek ; Gupta, Sumeet Kumar
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi
Volume :
53
Issue :
10
fYear :
2006
Firstpage :
2578
Lastpage :
2581
Abstract :
A grounded lamination gate (GLG) structure for high-kappa gate-dielectric MOSFETs is proposed, with grounded metal plates in the spacer oxide region. Two-dimensional device simulations performed on the new structure demonstrate a significant improvement with respect to the threshold voltage roll-off with increasing gate-dielectric constant (due to parasitic internal fringe capacitance), keeping the equivalent oxide thickness same. A simple fabrication procedure for the GLG MOSFET is also presented
Keywords :
MOSFET; high-k dielectric thin films; permittivity; 2D device simulations; diminished fringe-capacitance effects; equivalent oxide thickness; gate-dielectric constant; grounded lamination gate; grounded metal plates; high-K gate-dielectric MOSFET; parasitic internal fringe capacitance; silicon-on-insulator; spacer oxide region; threshold voltage; Conducting materials; Dielectric devices; Fabrication; Lamination; MOSFETs; Medical simulation; Parasitic capacitance; Permittivity; Silicon on insulator technology; Threshold voltage; High-; MOSFET; internal fringe capacitance; silicon-on-insulator (SOI); simulation; threshold voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2006.882268
Filename :
1705112
Link To Document :
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