• DocumentCode
    773728
  • Title

    High-level test compaction techniques

  • Author

    Ravi, Srivaths ; Lakshminarayana, Ganesh ; Jha, Niraj K.

  • Author_Institution
    C&C Res. Labs., NEC, Princeton, NJ, USA
  • Volume
    21
  • Issue
    7
  • fYear
    2002
  • fDate
    7/1/2002 12:00:00 AM
  • Firstpage
    827
  • Lastpage
    841
  • Abstract
    Available register-transfer level (RTL) test generation techniques do not make a concerted effort to reduce the test application time associated with the derived tests. Chip tester memory limitations, increasing tester costs, etc., make it imperative that the issue of generating compact tests at the RTL be addressed and consolidated with the known gains of high-level testing. In this paper, the authors provide a comprehensive framework for generating compact tests for an RTL circuit. They develop a series of techniques that exploit the inherent parallelism available in symbolic test(s) derived for RTL module(s). These techniques enable them to schedule testing of multiple modules in parallel as well as perform test pipelining. In addition, the authors also present design for testability (DFT) techniques for lowering test application time. Using a maximum bipartite matching formulation, they choose a low-overhead set of test enhancements that can achieve compact tests. The authors´ techniques can seamlessly plug into any generic high-level test framework. Their experimental results in the context of one such framework indicate that the proposed methodology achieves an average reduction in test application time of 54.2% for the example circuits
  • Keywords
    design for testability; logic testing; RTL circuit; RTL test generation; design for testability; high-level test compaction; maximum bipartite matching; symbolic testing; test application time; test pipelining; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit testing; Compaction; Costs; Design for testability; Investments; Manufacturing; Performance evaluation;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2002.1013895
  • Filename
    1013895