• DocumentCode
    774530
  • Title

    Efficient testing of SRAM with optimized march sequences and a novel DFT technique for emerging failures due to process variations

  • Author

    Chen, Qikai ; Mahmoodi, Hamid ; Bhunia, Swarup ; Roy, Kaushik

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    13
  • Issue
    11
  • fYear
    2005
  • Firstpage
    1286
  • Lastpage
    1295
  • Abstract
    With increasing inter-die and intra-die parameter variations in sub-100-nm process technologies, new failure mechanisms are emerging in CMOS circuits. These failures lead to reduction in reliability of circuits, especially the area-constrained SRAM cells. In this paper, we have analyzed the emerging failure mechanisms in SRAM caches due to transistor V/sub t/ variations, which results from process variations. Also we have proposed solutions to detect those failures efficiently. In particular, in this work, SRAM failure mechanisms under transistor V/sub t/ variations are mapped to logic fault models. March test sequences have been optimized to address the emerging failure mechanisms with minimal overhead on test time. Moreover, we have proposed a design for test circuit to complement the March test sequence for at-speed testing of SRAMs. The proposed technique, referred as double sensing, can be used to test the stability of SRAM cells during read operations. Using the proposed March test sequence along with the double sensing technique, a test time reduction of 29% is achieved, compared to the existing test techniques with the same fault coverage. We have also demonstrated that double sensing can be used during SRAM normal operation for online detection and correction of any number of random read faults.
  • Keywords
    SRAM chips; cache storage; design for testability; fault diagnosis; integrated circuit testing; CMOS circuits; March test sequences; SRAM cache; SRAM cells; SRAM failure mechanisms; SRAM testing; design for testability; double sensing technique; fault models; inter-die parameter variations; intra-die parameter variations; process variations; CMOS process; CMOS technology; Circuit faults; Circuit stability; Circuit testing; Failure analysis; Fluctuations; Logic; Random access memory; Threshold voltage; Design for test (DFT); March test; SRAM; failure mechanism; process variation;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2005.859565
  • Filename
    1564081