DocumentCode
775950
Title
FLO/STRESS: an integrated software module to predict stress in electronic products
Author
Bailey, C. ; Warner, M. ; Agha, A. ; Pericleous, K. ; Parry, J. ; Marooney, C. ; Reeves, H. ; Clark, I.
Author_Institution
Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London, UK
Volume
13
Issue
3
fYear
2002
fDate
6/1/2002 12:00:00 AM
Firstpage
143
Lastpage
148
Abstract
Software technology that predicts stress in electronic systems and packages, developed as part of TCS Programme, is described. The software is closely integrated within a thermal design tool providing the ability to simulate the coupled effects of airflow, temperature and stress on product performance. This integrated approach to analysis will help decrease the number of design cycles.
Keywords
circuit CAD; circuit analysis computing; electronics industry; mechanical engineering computing; product development; CAD; FLO STRESS software; TCS Programme; airflow; computer-aided analysis; design cycles; electronic product stress prediction; electronics industry; integrated software module; product performance; temperature; thermal design tool;
fLanguage
English
Journal_Title
Computing & Control Engineering Journal
Publisher
iet
ISSN
0956-3385
Type
jour
DOI
10.1049/cce:20020306
Filename
1015704
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