Plasma Metallization Coating and Its Adhesion to Microwave Transistor Substrate—Part 2: Experimental Study of 3-D Composite Coating

Author

Vysikaylo, Philipp I. ; Mitin, Valeriy S. ; Mitin, Aleksey V. ; Krasnobaev, Nikolay N. ; Belyaev, Victor V.

Author_Institution

Plasma Chem. Lab., Moscow Radiotechnical Inst., Moscow, Russia

Volume

43

Issue

6

fYear

2015

fDate

Jun-15

Firstpage

1901

Lastpage

1905

Abstract

This paper reports an experimental study of the previously proposed mechanism of adhesion of a plasma metal coating to a ceramic substrate by an example of beryllium oxide. This adhesion mechanism is based on the increase in the concentration of structural defects (vacancies) and electron exchange interaction of a metal-oxide beryllium pair during the plasma thermal activation of the process. Given the brazing of ceramic products with hard solders in hydrogen, the coating composition for metallization is determined. The optimal temperature of reactive plasma metal coating for strong adhesion to the ceramic substrate is found. Methods to improve the technology of plasma vacuum metallization using ion-plasma magnetron sputtering and ion implantation are proposed. Recommendations for the deposition of 3-D composite coatings with maximum adhesion are given.

Keywords

adhesion; brazing; ceramics; composite materials; exchange interactions (electron); ion implantation; metallisation; microwave transistors; plasma deposited coatings; plasma deposition; solders; sputter deposition; vacancies (crystal); 3D composite coating deposition; BeO; ceramic brazing; ceramic substrate; coating composition; electron exchange interaction; hard solders; ion implantation; ion-plasma magnetron sputtering; maximum adhesion; metal-oxide beryllium pair; microwave transistor substrate; optimal temperature; plasma metallization coating; plasma thermal activation; plasma vacuum metallization; reactive plasma metal coating; structural defect concentration; vacancies; Adhesives; Annealing; Ceramics; Coatings; Plasma temperature; Substrates; Diffusion of vacancies; high-power microwave devices; mechanism and kinetics of the formation of adhesion; plasma metal coating; power layer; power layer.;

fLanguage

English

Journal_Title

Plasma Science, IEEE Transactions on

Publisher

ieee

ISSN

0093-3813

Type

jour

DOI

10.1109/TPS.2015.2419694

Filename

7112521