• DocumentCode
    780201
  • Title

    Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device

  • Author

    Lo, Yu-Lung ; Kuo, Chih-Ping

  • Author_Institution
    Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    25
  • Issue
    1
  • fYear
    2002
  • fDate
    2/1/2002 12:00:00 AM
  • Firstpage
    50
  • Lastpage
    53
  • Abstract
    This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG on bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices is under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80°C was around 0.1 nm in the two proposed athermal packages
  • Keywords
    Bragg gratings; adhesives; annealing; compensation; optical fibre fabrication; optical fibres; thermal management (packaging); -40 to 80 C; AB thermally cured adhesive; Bragg wavelength variation; FBG tension; annealing; athermal bimaterial device; bonding process design; continuous device thermal state; fiber Bragg grating; manufacturing processes; packaging; pre-loading mechanism; temperature deviation compensation; thermal curing process; thermal state; Annealing; Bonding processes; Bragg gratings; Curing; Fiber gratings; Manufacturing processes; Optical fibers; Packaging; Process design; Temperature;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2002.1017685
  • Filename
    1017685