Half-conductive coupling interconnection technology for digital transmission between CMOS chips

Author

Devisch, Frédéric ; Maillard, Xavier ; Pan, Wei ; De Tandt, C. ; Vounckx, Roger ; Kuijk, Maarten

Author_Institution

Vrije Univ., Brussels, Belgium

Volume

25

Issue

1

fYear

2002

fDate

2/1/2002 12:00:00 AM

Firstpage

92

Lastpage

97

Abstract

This paper describes how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chip standard CMOS integrated circuits. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Measurements of a complete HC-coupling, digital communication link show reliable operation up to 100 Mb/s channel speed. The two flipped prototype CMOS chips were fabricated in 0.8-μm, 5-V CMOS. The I/O pads´ pitch was 150 μm

Keywords

CMOS integrated circuits; crosstalk; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; 0.8 micron; 100 Mbit/s; 150 micron; 5 V; CMOS chips; I/O pad pitch; channel speed; digital communication link; digital transmission; flip-chip standard CMOS integrated circuits; flipped prototype CMOS chips; half-conductive coupling interconnection technology; isolation ratio; reliable operation; CMOS integrated circuits; CMOS process; CMOS technology; Coupling circuits; Digital communication; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit technology; Semiconductor device measurement; Velocity measurement;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2002.1017690

Filename

1017690