• DocumentCode
    78079
  • Title

    A Monolithic CMOS-MEMS Oscillator Based on an Ultra-Low-Power Ovenized Micromechanical Resonator

  • Author

    Ming-Huang Li ; Chao-Yu Chen ; Cheng-Syun Li ; Chi-Hang Chin ; Sheng-Shian Li

  • Author_Institution
    Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    24
  • Issue
    2
  • fYear
    2015
  • fDate
    Apr-15
  • Firstpage
    360
  • Lastpage
    372
  • Abstract
    A fully monolithic complimentary metal-oxide- semiconductor-microelectormechanical systems (CMOS-MEMS) oscillator comprised of an ovenized double-ended tuning fork resonator to enable ultra-low heater power operation of only 0.47 mW over entire temperature span (-40 °C to 85 °C) and a low noise sustaining circuit to achieve low phase noise has been demonstrated in a Taiwan Semiconductor Manufacturing Company (TSMC) 0.35-μm CMOS process. The combination of low thermal conductivity material and high thermal isolation design is the key to attaining ultra-low-power heater operation in a sub-mW level. Passive temperature compensation scheme is also conducted in the proposed CMOS-MEMS resonator by an oxide-metal composite structure, showing a low temperature coefficient of frequency (TC f ) of only +5.1 ppm/°C, which is suited for the use in ovenized oscillator systems. By implementing a constant-resistance temperature control scheme, the frequency drift of the resonator smaller than 120 ppm from -40 °C to 85 °C is demonstrated in this paper, indicating an equivalent TC f smaller than 1 ppm/°C, a record-low value against its CMOSMEMS counterparts. The CMOS-MEMS oscillator operating at 1.2 MHz demonstrates a phase noise of -112 dBc/Hz at 1-kHz offset and -120 dBc/Hz at 1-MHz offset while drawing less than 1.3 mW. The entire power consumption of the ovenized oscillator system is confirmed to be less than 1.8 mW (oscillator + micro-oven), verifying the great potential of low power oven-controlled MEMS oscillators realized in CMOS-MEMS technology.
  • Keywords
    CMOS analogue integrated circuits; low-power electronics; micromechanical resonators; oscillators; temperature control; thermal conductivity; Passive temperature compensation scheme; TSMC CMOS process; complimentary metal-oxide-semiconductor-microelectormechanical systems; constant-resistance temperature control scheme; double-ended tuning fork resonator; frequency 1.2 MHz; frequency drift; high thermal isolation design; low noise sustaining circuit; low thermal conductivity material; monolithic CMOS-MEMS oscillator; oxide-metal composite structure; size 0.35 mum; temperature -40 degC to 85 degC; ultralow heater power operation; ultralow-power ovenized micromechanical resonator; Heating; Micromechanical devices; Oscillators; Resonant frequency; Temperature sensors; Thermal resistance; CMOS-MEMS; analog integrated circuit; micro oven; microresonator; monolithic integration; oscillator; phase noise; phase noise.; temperature compensation;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2331497
  • Filename
    6847690