• DocumentCode
    782283
  • Title

    The coil of the MBI bending magnets for the LHC injection transfer lines

  • Author

    Labutsky, S. ; Mejidzade, V. ; Pupkov, Yu. ; Rouvinsky, E. ; Sukhina, B.

  • Author_Institution
    Inst. of Nucl. Phys., Acad. of Sci., Novosibirsk, Russia
  • Volume
    12
  • Issue
    1
  • fYear
    2002
  • fDate
    3/1/2002 12:00:00 AM
  • Firstpage
    228
  • Lastpage
    231
  • Abstract
    All MBI bending magnets in each of the two LHC injection transfer lines will be powered in series. The limited output voltage of existing power converters lead to an unusual coil design avoiding external return bus-bars by combining two overlapping half-coils, electrically separated, with 3 1/2 turns each in a monolithic structure. The voltage between turns in one coil can reach up-to 3.6 kV. The coil has been designed with particular care for obtaining high interturn and ground insulation. Flux-free soldering of connections with plug-in cone sleeves is applied, allowing to execute water cooled current connections as prolongation of the coil conductor. Epoxy compound polymerization in the impregnation mould is obtained by passing overheated water in regulated cycles through the water circuit of the coil conductor. We describe the design basics as well as various test results of pre-series and series produced coils.
  • Keywords
    accelerator magnets; colliding beam accelerators; particle beam injection; proton accelerators; storage rings; superconducting magnets; LHC injection transfer lines; MBI bending magnets; epoxy compound polymerization; flux-free soldering; ground insulation; interturn insulation; monolithic structure; output voltage; overlapping half-coils; power converters; pre-series produced coils; series produced coils; unusual coil design; water cooled current connections; Circuits; Coils; Conductors; Insulation; Large Hadron Collider; Lead; Magnets; Polymers; Soldering; Voltage;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2002.1018388
  • Filename
    1018388