• DocumentCode
    782403
  • Title

    Heat Control of an Integrated Silica VMUX Using Constant Working Power

  • Author

    Zhang, Zhiyi ; Sun, Fengguo ; Lin, Peng ; Xiao, Gaozhi ; Wu, Yaming

  • Author_Institution
    Inst. for Microstructural Sci., Photonic Syst. Group, Ottawa, Ont.
  • Volume
    12
  • Issue
    5
  • fYear
    2006
  • Firstpage
    1054
  • Lastpage
    1059
  • Abstract
    An on-chip integrated silica variable multiplexer (VMUX) cannot be practically packaged as the involved variable optical attenuator (VOA) is associated with a large amount of heat change and the involved arrayed waveguide grating (AWG) is sensitive to temperature change. On the basis of our success in substantially reducing VOA´s power consumption, we have introduced an idle heater for each VOA channel to balance its attenuation-associated heat change and keep the whole arrayed VOA under constant working power. Consequently, a 40-channel AWG-VOA integrated VMUX can be easily stabilized at an optimum setting temperature by simply dissipating the same amount of heat with a conventional packaging. Simulations have shown that both the involved AWG and the VOA work properly in the VMUX device
  • Keywords
    arrayed waveguide gratings; cooling; electronics packaging; integrated optics; multiplexing equipment; optical attenuators; silicon compounds; arrayed waveguide grating; heat change; heat control; integrated silica VMUX; integrated silica variable multiplexer; variable optical attenuator; working power; Arrayed waveguide gratings; Multiplexing; Optical arrays; Optical attenuators; Optical variables control; Optical waveguides; Packaging; Silicon compounds; Temperature control; Waveguide transitions; Arrayed waveguide grating (AWG); integration; silica waveguides; thermal management; variable multiplexer (VMUX); variable optical attenuator (VOA);
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/JSTQE.2006.881874
  • Filename
    1707719