Title :
Study and design of step-index channel waveguide bends with large-angle and low-loss characteristics
Author :
Lin, Han-Bin ; Su, Jung-Young ; Liao, Yu-Pin ; Wang, Way-Seen
Author_Institution :
Dept. of Electr. Eng., China Inst. of Technol. & Commerce, Taipei, Taiwan
fDate :
6/1/1995 12:00:00 AM
Abstract :
By using micro-prisms, improved three-dimensional (3-D) bends of the embedded and buried waveguides of step-index profile are proposed. A simple phase compensation rule for the optimal design of the micro-prism is also presented. Through the simulation of 3-D semivectorial finite-difference beam propagation method, the transmission characteristics of the improved bends are shown to have been enhanced dramatically as compared with those of the conventional ones. Even for a bend angle of as large as 10°, the normalized transmitted power can still be greater than 95%. These results of 3-D bends are then compared with those of the two-dimensional (2-D) ones which are simplified from 3-D structures by the effective index method, and physical explanation of the discrepancy between the 3-D and 2-D results is introduced. The influences of waveguide structures and prism parameters on the transmission characteristics are discussed in detail. Some criteria for the design of large-angle low-loss 3-D improved bends are also accessed
Keywords :
finite difference methods; integrated optics; optical design techniques; optical losses; optical prisms; optical waveguide theory; waveguide discontinuities; 3-D semivectorial finite-difference beam propagation method; buried waveguides; design; effective index method; embedded waveguides; large-angle; low-loss; micro-prisms; phase compensation; simulation; step-index channel waveguide bends; three-dimensional bends; transmission characteristics; two-dimensional bends; Finite difference methods; Integrated optics; Optical crosstalk; Optical devices; Optical losses; Optical waveguides; Packaging; Photonic integrated circuits; Semiconductor waveguides; Two dimensional displays;
Journal_Title :
Quantum Electronics, IEEE Journal of