• DocumentCode
    78450
  • Title

    1 ppm/°C bandgap with multipoint curvature-compensation technique for HVIC

  • Author

    Yunwu Zhang ; Jing Zhu ; Weifeng Sun ; Bang Yang ; Zexiang Huang

  • Author_Institution
    Nat. ASIC Syst. Eng. Res. Center, Southeast Univ., Nanjing, China
  • Volume
    50
  • Issue
    25
  • fYear
    2014
  • fDate
    12 4 2014
  • Firstpage
    1908
  • Lastpage
    1910
  • Abstract
    A high-order curvature-compensated current mode bandgap reference (BGR) over a very wide temperature range is presented. High-order curvature correction for this reference is accomplished by the proposed multipoint corrected technique, which realises exponential curvature-compensation terms in lower and higher temperature ranges separately through simple structures. The compact multipoint curvature-compensation circuit cancels out the nonlinear terms of the BGR using sub-threshold operated metal-oxide semiconductor field effect transistors, which subtract those currents that are proportional to the nonlinearity out of the reference voltage. As a result, a flattened and better effect of curvature compensation in a wide temperature range is realised. The circuit performance was verified experimentally. The measurements indicate that the proposed BGR can achieve a temperature coefficient as low as 1.01 ppm/°C over the temperature range of 160°C (-40 to 120°C).
  • Keywords
    MOSFET circuits; compensation; current-mode circuits; reference circuits; BGR; HVIC; MCC circuit; MCCT; MOSFETs; TC; exponential curvature-compensation terms; high-order curvature correction; high-order curvature-compensated current mode bandgap reference; multipoint corrected technique; multipoint curvature-compensation technique; nonlinear terms; reference voltage; sub-threshold operated metal-oxide semiconductor field effect transistors; temperature -40 degC to 120 degC; temperature coefficient;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2014.2469
  • Filename
    6975752