• DocumentCode
    786018
  • Title

    A MEMS piggyback actuator for hard-disk drives

  • Author

    Toshiyoshi, Hiroshi ; Mita, Makoto ; Fujita, Hiroyuki

  • Author_Institution
    Inst. of Ind. Sci., Univ. of Tokyo, Japan
  • Volume
    11
  • Issue
    6
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    648
  • Lastpage
    654
  • Abstract
    This paper reports a new fabrication process and designing method to integrate MEMS piggyback actuators on a silicon-on-insulator (SOI) wafer with magnetic read/write heads of hard-disk drives. Large bandwidth of the tracking servo system is designed by reducing the load mass for the tracking microactuator to be around 40 μg. A prototype electrostatic MEMS actuator (2 mm × 3 mm × 0.6 mm) of multiple parallel plates has been successfully integrated by using high-aspect ratio microstructures (gap opening 2 μm into 50-μm-SOI wafer) patterned by deep reactive-ion-etching (DRIE). A dc displacement of 0.5 μm, which is almost the same size as data track width, has been obtained at a driving voltage of dc 60 V and the fundamental resonance is found at 16 kHz. An analytical model of the MEMS piggyback actuator has been proposed to predict electromechanical performance. The fabrication method proposed here is very simple and straightforward to put the head-element-drive mechanism into practice.
  • Keywords
    disc drives; electrostatic actuators; hard discs; silicon-on-insulator; sputter etching; 16 kHz; 60 V; MEMS piggyback actuator; SOI wafer; analytical model; deep reactive ion etching; electromechanical characteristics; electrostatic microactuator; fabrication process; hard disk drive; high aspect ratio microstructure; magnetic read/write head; tracking servo system; Actuators; Bandwidth; Design methodology; Fabrication; Hard disks; Magnetic heads; Micromechanical devices; Process design; Servomechanisms; Silicon on insulator technology;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.805054
  • Filename
    1097784