• DocumentCode
    786118
  • Title

    Parylene gas chromatographic column for rapid thermal cycling

  • Author

    Noh, Hong-Seok ; Hesketh, Peter J. ; Frye-Mason, Gregory C.

  • Author_Institution
    George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    11
  • Issue
    6
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    718
  • Lastpage
    725
  • Abstract
    This paper presents a parylene gas chromatographic column with an embedded heating element. The parylene coating on a silicon microchannel and parylene/parylene thermal bonding technique were employed to fabricate a parylene column. The heating element is a thin gold film evaporated on the corrugated surface of the parylene column having long and rectangular geometry. Joule heating via the thin gold film is a very effective heating system for a parylene column. ANSYS heat transfer analysis was performed to investigate the thermal cycling and temperature uniformity of the parylene column. The parylene column showed much faster heating and cooling rates as well as lower power consumption compared to a silicon/glass column. The temperature difference between the top and the bottom of a parylene column that is due to the low thermal conductivity of parylene could be reduced to less than 0.1 K by inserting a thin metal layer between two parylene layers, forming a triple layer structure (parylene/platinum/parylene).
  • Keywords
    chromatography; finite element analysis; heating elements; micromachining; polymers; temperature distribution; ANSYS heat transfer analysis; Au; Joule heating; Pt; Si; corrugated surface; embedded heating element; evaporated gold thin film; finite element method; metal layer; microfabrication technology; parylene coating; parylene gas chromatographic column; parylene/parylene thermal bonding; power consumption; rapid thermal cycling; silicon microchannel; temperature distibution; thermal conductivity; Bonding; Coatings; Corrugated surfaces; Geometry; Gold; Heating; Microchannel; Silicon; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.805052
  • Filename
    1097792