Title :
A microfabricated floating-element shear stress sensor using wafer-bonding technology
Author :
Shajii, Javad ; Ng, Kay-Yip ; Schmidt, Martin A.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
fDate :
6/1/1992 12:00:00 AM
Abstract :
A microfabricated floating-element (120 μm×140 μm×5 μm) liquid shear stress sensor has been developed using wafer-bonding technology. The sensor has been designed for high shear stresses (1-100 kPa) and high-pressure environments (up to 6600 psi) and utilizes a piezoresistive transduction scheme. Analytical and finite-element method (FEM) modeling have been performed to predict the sensor response. The sensor has been tested for both its mechanical integrity in high-pressure environments and its output response in the controlled environment of a cone and plate viscometer. The processing steps in the fabrication of the sensor, the analytical and FEM modeling, the experimental procedures, and the results of the experiments are described
Keywords :
electric sensing devices; finite element analysis; micromechanical devices; stress measurement; viscometers; 140 to 5 micron; 6600 psi; cone and plate viscometer; experimental procedures; fabrication; finite-element method; high shear stresses; high-pressure environments; liquid shear stress sensor; mechanical integrity; microfabricated floating-element; output response; piezoresistive transduction scheme; sensor response; wafer-bonding technology; Fabrication; Finite element methods; Mechanical sensors; Performance analysis; Piezoresistance; Predictive models; Semiconductor device modeling; Sensor phenomena and characterization; Stress; Testing;
Journal_Title :
Microelectromechanical Systems, Journal of
