• DocumentCode
    788674
  • Title

    Integrated circuit yield management and yield analysis: development and implementation

  • Author

    Stapper, Charles H. ; Rosner, Raymond J.

  • Author_Institution
    Jericho, VT, USA
  • Volume
    8
  • Issue
    2
  • fYear
    1995
  • fDate
    5/1/1995 12:00:00 AM
  • Firstpage
    95
  • Lastpage
    102
  • Abstract
    Integrated circuit manufacturing yields are not necessarily a function of chip area. Accurate yield analysis shows how the yield depends on circuit design and layout. By determining the probabilities of failure and critical areas for different defect types, it is possible to control and manage the yield of integrated circuits. This includes the manufacture of DRAM´s, SRAM´s, CMOS logic, ASIC´s, and CMOS and biCMOS microprocessors. Examples explain the method of meeting yield objectives by setting targets for yield components. In addition, the yield management approach allows for a systematic allocation of resources. Required defect-density learning determines the contamination levels for clean rooms and process equipment.<>
  • Keywords
    clean rooms; integrated circuit yield; management; resource allocation; ASICs; CMOS logic; CMOS microprocessors; DRAMs; SRAMs; biCMOS microprocessors; chip area; circuit design; circuit layout; clean rooms; contamination; defect-density learning; failure probabilities; integrated circuit manufacturing; process equipment; resource allocation; yield analysis; yield management;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.388016
  • Filename
    388016