DocumentCode
788674
Title
Integrated circuit yield management and yield analysis: development and implementation
Author
Stapper, Charles H. ; Rosner, Raymond J.
Author_Institution
Jericho, VT, USA
Volume
8
Issue
2
fYear
1995
fDate
5/1/1995 12:00:00 AM
Firstpage
95
Lastpage
102
Abstract
Integrated circuit manufacturing yields are not necessarily a function of chip area. Accurate yield analysis shows how the yield depends on circuit design and layout. By determining the probabilities of failure and critical areas for different defect types, it is possible to control and manage the yield of integrated circuits. This includes the manufacture of DRAM´s, SRAM´s, CMOS logic, ASIC´s, and CMOS and biCMOS microprocessors. Examples explain the method of meeting yield objectives by setting targets for yield components. In addition, the yield management approach allows for a systematic allocation of resources. Required defect-density learning determines the contamination levels for clean rooms and process equipment.<>
Keywords
clean rooms; integrated circuit yield; management; resource allocation; ASICs; CMOS logic; CMOS microprocessors; DRAMs; SRAMs; biCMOS microprocessors; chip area; circuit design; circuit layout; clean rooms; contamination; defect-density learning; failure probabilities; integrated circuit manufacturing; process equipment; resource allocation; yield analysis; yield management;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.388016
Filename
388016
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