Effect of strain rate on fatigue of low-tin lead-base solder

Author

Vaynman, Semyon

Author_Institution

Basic Ind. Res. Labs., Northwestern Univ., Evanston, IL, USA

Volume

12

Issue

4

fYear

1989

fDate

12/1/1989 12:00:00 AM

Firstpage

469

Lastpage

472

Abstract

Fatigue of low-tin lead-base solder was studied at different strain rates. The effect of tensile hold time (low strain rate) in reducing the number of cycles to failure was found to be much more dramatic than the effect of ramp time (higher strain rate). While increasing up to 1 h time per cycle for no-hold tests did not lead to fatigue life saturation, an increase in tensile hold time over a few minutes led to saturation in the number of cycles to failure. Differences in effects of hold and ramp were attributed to different mechanisms of solder fatigue fracture. It is concluded that fatigue life prediction of solder should be based on tests involving hold time

Keywords

failure analysis; fatigue testing; lead alloys; materials testing; soldering; thermal stress cracking; tin alloys; 5 s to 1 h; SnPb solders; effect of ramp time; effect of tensile hold time; fatigue fracture mechanisms; fatigue life; fatigue life prediction; no-hold tests; number of cycles to failure; solder fatigue fracture; strain rate effects; temperature cycling; tests involving hold time; Capacitive sensors; Failure analysis; Fatigue; Lead; Life testing; Soldering; Temperature; Tensile strain; Tensile stress; Thermomechanical processes;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.49003

Filename

49003