High-performance power package for power-integrated circuit devices

A high-performance version of a plastic dual-in-line package with improved reliability levels has been developed for high-power integrated circuit industrial and automotive applications. Superior thermal capability and reliability performances have been achieved with no increase in manufacturing cost or change in package outline. The development of this package is based on a package optimization approach. Development methodology and package characterization results are outlined. Data for production lots of the package show a thermal performance improvement of up to 35% compared with currently available packages, without the aid of an external heat sink. Furthermore, qualification test results indicate that this new package has an excellent reliability performance and its long-term survival exceeds the industry standard requirements. An improvement by a factor of 4 in the resistance to device metal deformation and a factor of 7 in wire-bond thermal fatigue has been achieved as a result of reducing the shear and normal stresses inside the package by proper selection of a state-of-the-art low-modulus molding compound and optimizing the leadframe design