Influence of tester, test method, and device type on CDM ESD testing

Author

Verhaege, Koen ; Groeseneken, Guido V. ; Maes, Herman E. ; Egger, Peter ; Gieser, Horst

Author_Institution

IMEC, Leuven, Belgium

Volume

18

Issue

2

fYear

1995

fDate

6/1/1995 12:00:00 AM

Firstpage

284

Lastpage

294

Abstract

In this paper, the charged device model (CDM) electrostatic discharge (ESD) events emulated by different commercial concerns are studied. First, the characteristic waveforms, defined by the EOS/ESD CDM ESD draft standard (DS5.3-1993), are compared and some major problems related to the specification of socketed CDM testers are discussed. Second, the results of an extensive CDM ESD test program are reported. The influences of various test parameters, such as the charging method (direct or field), the discharge mode (contact or noncontact), the charge pin (substrate pin or pin to be discharged) and the device package are studied. Finally, correlations of CDM ESD test results (the voltage thresholds and electrical failure signatures) are investigated

Keywords

electrostatic discharge; failure analysis; integrated circuit reliability; integrated circuit testing; production testing; CDM ESD testing; IC testing; characteristic waveforms; charge pin; charged device model; charging method; device package; device type; discharge mode; electrical failure signatures; electrostatic discharge; socketed CDM testers; test method; voltage thresholds; Circuit testing; Electrostatic discharge; Integrated circuit testing; Packaging; Probes; Robots; Senior members; Sockets; Stress; System testing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.390307

Filename

390307