DocumentCode
794159
Title
Thermal modeling and experimental techniques for microwave bipolar devices
Author
Negus, Kevin J. ; Franklin, Robert W. ; Yovanovich, M.M.
Author_Institution
Avantek Inc., Newark, CA, USA
Volume
12
Issue
4
fYear
1989
fDate
12/1/1989 12:00:00 AM
Firstpage
680
Lastpage
689
Abstract
Many thermal issues facing the microwave bipolar industry are discussed, and the application of experimental and modeling techniques is demonstrated for real microwave devices. The liquid-crystal transition method of thermal measurement is shown to be useful for modern bipolar devices because the method can resolve temperatures with excellent spatial resolution for modern small-geometry devices. An experimental technique for determining thermal resistance from device terminal characteristics is also shown to be adequate for some applications and packages. Thermal analysis through the use of an exact solution to a three-dimensional model of the semiconductor die is also presented. The modeling technique compares extremely well with detailed measurements by liquid-crystal transition on microwave bipolar devices. The application of experimental and analytical thermal characterization is discussed and shown to be important for problems such as device optimization and reliability predictions
Keywords
bipolar transistors; semiconductor device models; solid-state microwave devices; thermal resistance measurement; experimental techniques; liquid-crystal transition method; microwave bipolar devices; modern small-geometry devices; optimization predictions; reliability predictions; semiconductor die three-dimensional model; spatial resolution; terminal characteristics; thermal modeling techniques; thermal resistance; Electrical resistance measurement; Electromagnetic heating; Infrared detectors; Liquid crystal devices; Microwave devices; Microwave theory and techniques; Semiconductor device packaging; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.49033
Filename
49033
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