DocumentCode
797650
Title
Electroless nickel films: properties and fabricated cavity structure
Author
Yi, Seung Hwan ; Von Preissig, Fred J. ; Kim, Eun Sok
Author_Institution
Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
Volume
11
Issue
4
fYear
2002
fDate
8/1/2002 12:00:00 AM
Firstpage
293
Lastpage
301
Abstract
Properties of 6-μm-thick films of electroless, phosphorus-containing nickel grown on evaporated Ni seed layers were measured as a function of bath conditions. The bath variables were temperature, pH, and hypophosphorus acid concentration. Residual mechanical stress at room temperature was measured by a bulge test method, as was elastic modulus. Growth rate, crystallinity, and phosphorus content were also measured. Stress was sensitive to all bath variables, and the range encountered was 4 MPa compressive to 255 MPa tensile. A proper set of nickel growth conditions combined with the use of a stiction-inhibiting parylene-D film led to the successful fabrication of a self-supported roof structure forming a large-area, sealable cavity.
Keywords
X-ray chemical analysis; X-ray diffraction; Young´s modulus; electroless deposited coatings; electroless deposition; internal stresses; membranes; metallic thin films; micromachining; micromechanical devices; nickel; phosphorus; stiction; EDS; MEMS; Ni:P; X-ray diffraction; Young´s modulus; bath variables; bulge test; cavity structure; crystallinity; elastic modulus; electroless films; evaporated seed layers; growth rate; hypophosphorus acid concentration; large capillary force; large-area sealable cavity; membrane; micromachined structures; mold-photoresist treatment; phosphorus content; profilometry; residual mechanical stress; self-supported roof structure; self-supported structure; stiction-inhibiting parylene-D film; strong metallic films; Compressive stress; Crystallization; Mechanical variables measurement; Nickel; Residual stresses; Stress measurement; Temperature measurement; Temperature sensors; Tensile stress; Testing;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2002.800614
Filename
1022839
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