• DocumentCode
    797704
  • Title

    IR uncooled bolometers based on amorphous GexSi1-xOy on silicon micromachined structures

  • Author

    Iborra, Enrique ; Clement, Marta ; Herrero, Lucia Vergara ; Sangrador, Jesus

  • Author_Institution
    Departamento de Tecnologia Electronica, Univ. Politecnica de Madrid, Spain
  • Volume
    11
  • Issue
    4
  • fYear
    2002
  • fDate
    8/1/2002 12:00:00 AM
  • Firstpage
    322
  • Lastpage
    329
  • Abstract
    In this work, we present the fabrication of bulk micromachined microbolometers made of amorphous germanium-silicon-oxygen compounds (GexSi1-xOy) grown by reactive sputtering of a Ge0.85Si0.15 target. We describe the complete procedure for fabricating thermally isolated microbolometers consisting of GexSi1-xOy sensing films deposited on sputtered silicon dioxide membranes suspended over a silicon substrate. The electrical properties of the sensitive material are set by controlling the deposition parameters of the sputtering technique. Under optimum deposition conditions, GexSi1-xOy layers with moderate electrical resistivity and thermal coefficient at room temperature as high as -4.2% · K-1 can be obtained. Isolated structures measured at atmospheric pressure in air have a thermal conductance of 3 × 10-6 W · K-1 and a thermal capacitance of 6·10-9 W · s · K-1, yielding a response time of 1.8 ms. Bolometers with an IR responsivity of 380 V · W-1 and a NEDT of 3.85 K at 100 nA bias current are obtained. The use of sputtered films allows designing a fully low-temperature fabrication process, wholly compatible with silicon integrated circuit technologies.
  • Keywords
    Ge-Si alloys; amorphous semiconductors; bolometers; electrical resistivity; infrared detectors; micromachining; microsensors; sputter deposition; thermal conductivity; 1.8 ms; 100 nA; Ge0.85Si0.15; Ge0.85Si0.15 target; GexSi1-xOy-SiO2-Si; IR responsivity; IR uncooled bolometers; Si; Si micromachined structures; amorphous GexSi1-xOy; bias current; bulk micromachining; electrical properties; electrical resistivity; isolated structures; low-temperature fabrication process; optimum deposition conditions; reactive sputtering; response time; silicon integrated circuit technology compatibility; sputtered SiO2 membranes; sputtering deposition parameters; thermal capacitance; thermal coefficient; thermal conductance; thermally isolated microbolometers; Amorphous materials; Biomembranes; Bolometers; Electric resistance; Fabrication; Semiconductor films; Silicon compounds; Sputtering; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.800926
  • Filename
    1022843