Plasma Damage-Enhanced Negative Bias Temperature Instability in Low-Temperature Polycrystalline Silicon Thin-Film Transistors

In this letter, a mechanism that will make negative bias temperature instability (NBTI) be accelerated by plasma damage in low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs) is presented. The experimental results confirm that the mechanism, traditionally found in the thin gate-oxide devices, does exist also in LTPS TFTs. That is, when performing the NBTI measurement, the LTPS TFTs with a larger antenna ratio will have a higher degree in degradation of the threshold voltage, effective mobility, and drive current under NBTI stress. By extracting the related device parameters, it was demonstrated that the enhancement is mainly attributed to the plasma-damage-modulated creating of interfacial states, grain boundary trap states, and fixed oxide charges. It could be concluded that plasma damage will speed up the NBTI and should be avoided for the LTPS TFT circuitry design