A novel valveless micropump with electrohydrodynamic enhancement for high heat flux cooling

Author

Singhal, Vishal ; Garimella, Suresh V.

Author_Institution

Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA

Volume

28

Issue

2

fYear

2005

fDate

5/1/2005 12:00:00 AM

Firstpage

216

Lastpage

230

Abstract

Integrated microchannel cooling systems, with micropumps integrated into microchannels, are an attractive alternative to stand-alone micropumps for liquid-cooled microchannel heat sinks. A new micropump design capable of integration into microchannels and especially suited for electronics cooling is presented. It combines induction electrohydrodynamics (EHD) with a valveless nozzle-diffuser micropump actuated using a vibrating diaphragm. A comprehensive numerical model of the micropump has been developed to study the combined effect of EHD and valveless micropumping. The numerical model has been validated using theoretical and experimental results from the literature. The flow rate achievable from the new micropump is presented and the effect of several key parameters on the micropump performance investigated.

Keywords

cooling; electrohydrodynamics; integrated circuit packaging; micropumps; thermal management (packaging); electronics cooling; heat flux cooling; induction electrohydrodynamics; integrated microchannel cooling systems; liquid cooled microchannel heat sinks; numerical modeling; valveless micropump; vibrating diaphragm; Conductivity; Electrodes; Electrohydrodynamics; Electronics cooling; Frequency; Heat sinks; Microchannel; Micropumps; Numerical models; Pumps; Electronics cooling; induction electrohydrodynamics (EHD); microchannels; micropumps; nozzle-diffuser action; valveless pumping;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2005.847430

Filename

1427845