DocumentCode
800286
Title
Coupling between differential signals and the dc power-bus in multilayer PCBs
Author
Wang, Chen ; Leone, Marco ; Drewniak, James L. ; Orlandi, Antonio
Author_Institution
Nvidia Corp., Santa Clara, CA, USA
Volume
28
Issue
2
fYear
2005
fDate
5/1/2005 12:00:00 AM
Firstpage
337
Lastpage
345
Abstract
Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.
Keywords
coupled circuits; electromagnetic interference; electronic engineering computing; finite difference time-domain analysis; microstrip lines; printed circuits; analytical cavity model; common-mode transfer impedances; coupling; dc power bus; differential signals; full-wave finite-difference time-domain simulations; multilayer PCBs; noise; signal current imbalance; Analytical models; Circuit noise; Electromagnetic interference; Electromagnetic waveguides; Finite difference methods; Impedance; Nonhomogeneous media; Signal analysis; Time domain analysis; Voltage; Differential signaling; power-bus noise; signal imbalance; signal integrity; via transition;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.846938
Filename
1427858
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