• DocumentCode
    800286
  • Title

    Coupling between differential signals and the dc power-bus in multilayer PCBs

  • Author

    Wang, Chen ; Leone, Marco ; Drewniak, James L. ; Orlandi, Antonio

  • Author_Institution
    Nvidia Corp., Santa Clara, CA, USA
  • Volume
    28
  • Issue
    2
  • fYear
    2005
  • fDate
    5/1/2005 12:00:00 AM
  • Firstpage
    337
  • Lastpage
    345
  • Abstract
    Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.
  • Keywords
    coupled circuits; electromagnetic interference; electronic engineering computing; finite difference time-domain analysis; microstrip lines; printed circuits; analytical cavity model; common-mode transfer impedances; coupling; dc power bus; differential signals; full-wave finite-difference time-domain simulations; multilayer PCBs; noise; signal current imbalance; Analytical models; Circuit noise; Electromagnetic interference; Electromagnetic waveguides; Finite difference methods; Impedance; Nonhomogeneous media; Signal analysis; Time domain analysis; Voltage; Differential signaling; power-bus noise; signal imbalance; signal integrity; via transition;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.846938
  • Filename
    1427858