DocumentCode
8011
Title
Mode Mixity Dependence of Interfacial Fracture Toughness in Organic Electronic Structures
Author
Tong, Tiffany M. ; Ting Tan ; Rahbar, Nima ; Soboyejo, Winston O.
Author_Institution
Dept. of Electr. Eng., Princeton Univ., Princeton, NJ, USA
Volume
14
Issue
1
fYear
2014
fDate
Mar-14
Firstpage
291
Lastpage
299
Abstract
This paper presents the results of a combined experimental and theoretical study of interfacial fracture in organic electronic structures. Interfacial fracture toughness is investigated as a function of mode mixity using Brazil disk specimens. The measured fracture toughness values are then compared with predictions determined from crack-tip shielding estimates and atomic force microscopy measurements of adhesion between layers that are relevant to organic electronic structures. The interfacial and layer fracture mechanics are elucidated before discussing the implications for the design of robust organic electronic structures.
Keywords
adhesion; atomic force microscopy; cracks; fracture mechanics; fracture toughness; organic semiconductors; Brazil disk; atomic force microscopy; crack-tip shielding estimate; interfacial fracture toughness; layer adhesion; mode mixity dependence; organic electronic structures; robust organic electronic structure; Flexible electronic devices; Fracture mechanics; Light emitting diodes; Solar cells; Flexible electronic devices; fracture mechanics; interfacial adhesion; organic light-emitting devices; organic solar cells;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2013.2256788
Filename
6494274
Link To Document