DocumentCode
80273
Title
Device Modeling for Understanding AlGaN/GaN HEMT Gate-Lag
Author
Ramanan, Narayanan ; Bongmook Lee ; Misra, Vishal
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume
61
Issue
6
fYear
2014
fDate
Jun-14
Firstpage
2012
Lastpage
2018
Abstract
Using a simple simulation framework, it is shown that a passivation dielectric that minimizes surface leakage and creates a high density of shallow traps at the surface is vital to minimize the formation of the virtual gate and eliminate AlGaN/GaN HEMT gate-lag. Under large negative gate voltage, this is also expected to create higher fields and current crowding at the gate edge, promoting an increase in total gate leakage. While the AlGaN barrier properties are also found to impact gate-lag, the use of a passivation dielectric that minimizes surface leakage can overpower it´s influence and suppress current collapse. Access region shrinking and the use of a longer gate are also found to improve gate-lag.
Keywords
III-V semiconductors; aluminium compounds; dielectric devices; gallium compounds; high electron mobility transistors; leakage currents; passivation; semiconductor device models; wide band gap semiconductors; AlGaN barrier properties; AlGaN-GaN; AlGaN-GaN HEMT gate-lag; current crowding; gate leakage; negative gate voltage; passivation dielectric; region shrinking; simple simulation framework; surface leakage; Aluminum gallium nitride; Dielectrics; Electron traps; Gallium nitride; HEMTs; Logic gates; Passivation; AlGaN/GaN; HEMT; current collapse; gate-lag; high electron mobility transistor; passivation; reliability; reliability.;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2313814
Filename
6798730
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