• DocumentCode
    80273
  • Title

    Device Modeling for Understanding AlGaN/GaN HEMT Gate-Lag

  • Author

    Ramanan, Narayanan ; Bongmook Lee ; Misra, Vishal

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    61
  • Issue
    6
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    2012
  • Lastpage
    2018
  • Abstract
    Using a simple simulation framework, it is shown that a passivation dielectric that minimizes surface leakage and creates a high density of shallow traps at the surface is vital to minimize the formation of the virtual gate and eliminate AlGaN/GaN HEMT gate-lag. Under large negative gate voltage, this is also expected to create higher fields and current crowding at the gate edge, promoting an increase in total gate leakage. While the AlGaN barrier properties are also found to impact gate-lag, the use of a passivation dielectric that minimizes surface leakage can overpower it´s influence and suppress current collapse. Access region shrinking and the use of a longer gate are also found to improve gate-lag.
  • Keywords
    III-V semiconductors; aluminium compounds; dielectric devices; gallium compounds; high electron mobility transistors; leakage currents; passivation; semiconductor device models; wide band gap semiconductors; AlGaN barrier properties; AlGaN-GaN; AlGaN-GaN HEMT gate-lag; current crowding; gate leakage; negative gate voltage; passivation dielectric; region shrinking; simple simulation framework; surface leakage; Aluminum gallium nitride; Dielectrics; Electron traps; Gallium nitride; HEMTs; Logic gates; Passivation; AlGaN/GaN; HEMT; current collapse; gate-lag; high electron mobility transistor; passivation; reliability; reliability.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2313814
  • Filename
    6798730