DocumentCode
802808
Title
Thermal analysis of micromirrors for high-energy applications
Author
Zhang, Jianglong ; Lee, Yung-Cheng ; Tuantranont, Adisorn ; Bright, Victor M.
Author_Institution
Reflectivity Inc., Sunnyvale, CA, USA
Volume
26
Issue
3
fYear
2003
Firstpage
310
Lastpage
317
Abstract
This paper presents the results of an investigation of the thermal mechanism between lasers and surface-micromachined micromirrors. Finite element models using ABAQUS are established and used to study the temperature distribution on the surface of micromirrors under high-power laser illumination. It is shown that heat conduction through the gas gap between the mirror surface and the substrate is the dominant thermal dissipation mechanism for high surrounding gas pressure, while heat conduction through the flexures is dominant for low surrounding gas pressure. Based on the simulation results, two novel methods are proposed in order to tolerate more power input under low surrounding gas pressure. The results of optical power testing validate these models, and indicate that these two approaches are efficient in improving micromirror performance for high-energy applications.
Keywords
finite element analysis; heat conduction; micromirrors; semiconductor device packaging; temperature distribution; ABAQUS; finite element models; gas gap; heat conduction; high-energy applications; high-power laser illumination; micromirror surface; micromirrors; optical power testing; simulation results; surface-micromachined micromirrors; surrounding gas pressure; temperature distribution; thermal analysis; thermal dissipation mechanism; Finite element methods; Gas lasers; Laser modes; Lighting; Micromirrors; Mirrors; Surface emitting lasers; Temperature distribution; Testing; Thermal conductivity;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2003.818050
Filename
1236533
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