DocumentCode
805507
Title
An interchange format for process and device simulation
Author
Duvall, Steven G.
Author_Institution
Intel Corp., Santa Clara, CA, USA
Volume
7
Issue
7
fYear
1988
fDate
7/1/1988 12:00:00 AM
Firstpage
741
Lastpage
754
Abstract
A standard format for transmitting profiles of semiconductor structures between sites and between tools is described. The standard, called the profile interchange format (PIF), is a flexible and hierarchical format, capable of storing descriptions of semiconductor structures such as those produced and used by process and device simulators. It can store detailed descriptions of the geometry, attribute profiles, material properties, and transient behavior of a single structure or a collection of structures. Two equivalent forms of the PIF are proposed to resolve conflicting demands placed on the format by its two primary uses, which are transmitting profiles between sites and local use as a database for process and device simulation. The `intersite´ form of the PIF, which can be viewed as an extension of the electronic design interchange between sites, most importantly, portability. The `intertool´ form of the PIF is, in concept, equivalent in descriptive capabilities to the intersite form, but is intended to accommodate the needs of profile interchange between tools, most importantly, efficient storage and access of data. The PIF in both modes can be extended and modified to accommodate local needs
Keywords
circuit CAD; digital simulation; electronic engineering computing; integrated circuit technology; semiconductor technology; CAD; IC design; attribute profiles; computer aided design; database; device geometry; device simulation; electronic design interchange; hierarchical format; intersite form; intertool; material properties; portability; process simulator; profile interchange format; semiconductor structures; transient behavior; Analytical models; Capacitance; Circuits; Databases; Doping profiles; Geometry; Material properties; Proposals; Semiconductor device testing; Software packages;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.3945
Filename
3945
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