DocumentCode :
807095
Title :
A multiparameter implantable microstimulator SOC
Author :
Wang, Chua-Chin ; Lee, Tzung-Je ; Hsiao, Yu-Tzu ; Chio, U. Fat ; Huang, Chi-Chun ; Chin, Jia-Jin J. ; Hsueh, Ya-Hsin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume :
13
Issue :
12
fYear :
2005
Firstpage :
1399
Lastpage :
1402
Abstract :
Various implantable microstimulators have been proposed for clinical applications in recent years. Most of the no-battery implanted devices can be powered by a transcutaneous magnetic coupling, which basically utilizes an external transmitter coil to power and communicate with the implanted device. Small chip area and low power consumption are the keys of the implanted device. Therefore, we propose a C-less (no capacitor) area-saving ASK demodulator in this work to get rid of those large discrete capacitors required for low-frequency ASK demodulation. Additionally, a power regulator supplying a stable VDD/spl I.bar/OUT is also built in to resolve the unstable supply voltage problem resulted from the inductive link. Besides, a multiparameter control protocol which has an area advantage over microcontroller-based solutions is also proposed for various pain treatments of muscles and stimulating applications.
Keywords :
biomedical electronics; demodulators; inductive power transmission; integrated circuit design; system-on-chip; C-less area-saving ASK demodulator; SoC; discrete capacitor; microcontroller-based solution; multiparameter control protocol; multiparameter implantable microstimulator; neural interface; nonreturn-to-zero; power regulator; system-on-chip; telemetry; unstable supply voltage problem; Amplitude shift keying; Capacitors; Coils; Couplings; Demodulation; Energy consumption; Magnetic devices; Power supplies; Regulators; Transmitters; Implantable; microstimulator; neural interface; non-return-to-zero (NRZ); system-on-chip; telemetry;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2005.862719
Filename :
1583666
Link To Document :
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