Electrical-Thermal Co-Simulation for DC IR-Drop Analysis of Large-Scale Power Delivery

Author

Tianjian Lu ; Jian-Ming Jin

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA

Volume

4

Issue

2

fYear

2014

fDate

Feb. 2014

Firstpage

323

Lastpage

331

Abstract

For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary to consider the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method (FEM) because of its capabilities in modeling complex geometries and materials. To deal with large-scale problems, a domain decomposition scheme is applied to the FEM to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.

Keywords

finite element analysis; large-scale systems; microprocessor chips; DC IR-drop analysis; FEM; Joule heating; complex geometry; complex materials; domain decomposition; electrical-thermal co-simulation; finite element method; integrated circuits; large-scale power delivery; large-scale problems; multiple processors; Arrays; Boundary conditions; Finite element analysis; Program processors; Resistance heating; Through-silicon vias; Electrical-thermal co-simulation; finite element method; finite element tearing and interconnecting; on-chip power grid; parallel computing; power delivery; through silicon vias (TSVs);

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2013.2275271

Filename

6578141