DocumentCode :
808396
Title :
1st Electronics Systemintegration Technology Conference (ESTC 2006)
Volume :
29
Issue :
1
fYear :
2006
Firstpage :
64
Lastpage :
64
Abstract :
Provides notice of upcoming conference events of interest to practitioners and researchers.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2006.870205
Filename :
1583787
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=808396