DocumentCode :
80937
Title :
Highly Laminated Soft Magnetic Electroplated CoNiFe Thick Films
Author :
Jooncheol Kim ; Minsoo Kim ; Herrault, Florian ; Jae Park ; Allen, Mark G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
4
fYear :
2013
fDate :
2013
Firstpage :
5000204
Lastpage :
5000204
Abstract :
The fabrication and characterization of highly laminated (~40 layers), thick (~40 μm) films of magnetically soft cobalt-nickel-iron are presented. Thick film fabrication is based on automated sequential electrodeposition of alternating CoNiFe and copper layers, followed by selective copper removal. The film, comprised tens of 1 μm thick laminations, exhibits saturation flux density of 1.8 T and coercivity of approximately 1.3 Oe. High-frequency film characterization took place in a 36-turn test inductor, which demonstrated constant inductance of 1.6 μH up to 10 MHz, indicating suppressed eddy-current loss. Quality factor exceeding 40 at 1 MHz, surpassing the performance of similarly fabricated Permalloy (Ni80Fe20) films.
Keywords :
Permalloy; coercive force; electroplating; laminates; magnetic thin films; CoNiFe; Permalloy films; automated sequential electrodeposition; coercivity; eddy-current loss; highly laminated soft magnetic electroplated thick films; saturation flux density; Coercive force; Copper; Lamination; Magnetic cores; Magnetic multilayers; Saturation magnetization; Soft magnetic materials; Soft magnetic materials; eddy-current losses; laminated CoNiFe film; magnetic core inductor;
fLanguage :
English
Journal_Title :
Magnetics Letters, IEEE
Publisher :
ieee
ISSN :
1949-307X
Type :
jour
DOI :
10.1109/LMAG.2013.2284757
Filename :
6655912
Link To Document :
بازگشت