Modeling and simulation of interconnection delays and crosstalks in high-speed integrated circuits

Author

Gao, David S. ; Yang, Andrew T. ; Kang, Sung Mo

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

Volume

37

Issue

1

fYear

1990

fDate

1/1/1990 12:00:00 AM

Firstpage

1

Lastpage

9

Abstract

A computer model for n parallel microstrip lines is developed for circuit simulation. This model for the lossy transmission line system can be readily implemented into circuit simulators and can accurately simulate the delay and crosstalk effects of interconnects in high-speed integrated circuits. Modal analysis is applied to decouple the n-coupled-line system into n independent lines, and the characteristic solutions of telegraph equations are represented by a set of simple time-varying equivalent circuits. The model has been implemented in a general-purpose circuit simulator, iSMILE, which is compatible with SPICE. Simulation results on propagation delay times and crosstalk are presented for high-speed GaAs HEMT (high-electron-mobility transistor) integrated circuits

Keywords

circuit analysis computing; crosstalk; delays; digital integrated circuits; equivalent circuits; field effect integrated circuits; GaAs; HEMT IC; MESFET IC; characteristic solutions; circuit simulation; computer model; crosstalks; general-purpose circuit simulator; high-electron-mobility transistor; high-speed integrated circuits; iSMILE; interconnection delays; lossy transmission line system; modal analysis; parallel microstrip lines; propagation delay times; telegraph equations; time-varying equivalent circuits; Circuit simulation; Computational modeling; Concurrent computing; Crosstalk; Delay; HEMTs; High speed integrated circuits; Integrated circuit interconnections; Integrated circuit modeling; Microstrip;

fLanguage

English

Journal_Title

Circuits and Systems, IEEE Transactions on

Publisher

ieee

ISSN

0098-4094

Type

jour

DOI

10.1109/31.45685

Filename

45685