• DocumentCode
    816535
  • Title

    1/f noise in n- and p-channel MOS devices through irradiation and annealing

  • Author

    Meisenheimer, T.L. ; Fleetwood, D.M. ; Shaneyfelt, M.R. ; Riewe, L.C.

  • Author_Institution
    Sandia Nat. Lab., Albuquerque, NM, USA
  • Volume
    38
  • Issue
    6
  • fYear
    1991
  • fDate
    12/1/1991 12:00:00 AM
  • Firstpage
    1297
  • Lastpage
    1303
  • Abstract
    The 1/f noise of n- and p-channel MOS transistors was investigated through irradiation and biased anneals. While the increase in noise during irradiation is similar for both types of devices, the noise differs significantly in response to biased anneals. In particular, the noise decreases with decreasing ΔVot during positive-bias anneals in nMOS transistors but increases during positive-bias anneals for pMOS transistors. Conversely, negative bias anneals increase the noise in nMOS devices but decrease the noise in pMOS devices. These results are explained in terms of majority carrier trapping and detrapping at oxide defects near the Si/SiO2 interface. Under normal operating bias conditions (positive bias for nMOS and negative bias for pMOS), the 1/f noise of both n- and p-channel transistors decreases through postirradiation annealing
  • Keywords
    X-ray effects; annealing; electron device noise; gamma-rays; insulated gate field effect transistors; semiconductor-insulator boundaries; 1/f noise; MOS transistors; Si-SiO2 interface; annealing; biased anneals; detrapping at oxide defects; irradiation; majority carrier trapping; nMOS transistors; noise reduction; pMOS transistors; postirradiation annealing; Annealing; Circuit noise; Contracts; Laboratories; MOS devices; MOSFETs; Noise measurement; Semiconductor device measurement; Testing; Working environment noise;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.124108
  • Filename
    124108