DocumentCode
817876
Title
A new circuit augmentation method for modeling of interconnects and passive components
Author
Kolstad, Joel ; Blevins, Chris ; Dunn, John M. ; Weisshaar, Andreas
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Oregon State Univ., Corvallis, OR, USA
Volume
29
Issue
1
fYear
2006
Firstpage
67
Lastpage
77
Abstract
This paper presents a new methodology for automated broadband model generation from S-parameter data for interconnects and passive components. The new methodology is based on augmenting an existing equivalent circuit model with a macromodel (black-box) network described by rational functions while simultaneously perturbing the equivalent circuit component values. The macromodel network is determined using standard least-squares or vector-fitting approaches. The perturbation of the equivalent circuit parameter values is achieved during the macromodel generation by means of global optimization based on intelligent search algorithms. The new approach is demonstrated on several two-port test example structures including a broadband probe tip structure and a CMOS spiral inductor.
Keywords
S-parameters; circuit simulation; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; CMOS spiral inductor; S-parameter data; broadband probe tip structure; circuit augmentation; circuit simulation; equivalent circuit model; intelligent search algorithms; interconnect modeling; least squares approach; macromodel network; passive components; rational functions; vector fitting approach; Circuit simulation; Circuit testing; Computational modeling; Convolution; Equivalent circuits; Frequency domain analysis; Integrated circuit interconnections; Probes; SPICE; Scattering parameters; Circuit simulation; equivalent circuit; interconnect; macromodel; passive device; passivity; rational function approximation;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.862643
Filename
1589133
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