Title :
Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging
Author :
Schacham, S.E. ; Merkelo, Henri ; Hwang, L.-T. ; McCredie, Bradley D. ; Veatch, Mark S. ; Turlik, I.
Author_Institution :
MCNC Center for Microelectron., Research Triangle Park, NC, USA
fDate :
2/1/1992 12:00:00 AM
Abstract :
A detailed comparison between optical and electrical interconnections is presented, with the emphasis on advantages and drawbacks of optical link utilization. The impact of attenuation, dispersive degradation, and fan out on signal integrity is discussed. The implementation of a polyimide optical waveguide in the MCNC package is discussed
Keywords :
hybrid integrated circuits; integrated optoelectronics; metallisation; modules; optical interconnections; packaging; polymers; MCNC package; attenuation; comparative evaluation; dispersive degradation; electrical interconnections; fan out; high performance packaging; multichip modules; optical interconnections; optical link utilization; polyimide optical waveguide; signal integrity; Frequency; High speed optical techniques; Integrated circuit interconnections; Optical attenuators; Optical fiber communication; Optical interconnections; Optical noise; Optical reflection; Optical waveguides; Packaging;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
