DocumentCode
821053
Title
Determination and reduction of the capacitance associated with the bonding pads of planar millimeter-wave mixer diodes
Author
Wells, Jonathan A. ; Cronin, Nigel J.
Author_Institution
Dept. of Phys., Bath Univ., UK
Volume
2
Issue
7
fYear
1992
fDate
7/1/1992 12:00:00 AM
Firstpage
297
Lastpage
299
Abstract
A calculation of the capacitance associated with the metal bonding pads of a planar millimeter-wavelength mixer diode is presented. This capacitance is the largest component associated with such a device, contributing a calculated 22 fF toward a total diode capacitance of 30 fF. A demonstration of how the pad capacitance can be almost halved by incorporating an air bridge into the diode structure is included. Computer simulations show that this additional processing step can cause a 1.2-dB drop in mixer conversion loss at 94 GHz.<>
Keywords
capacitance; mixers (circuits); semiconductor device models; semiconductor diodes; solid-state microwave devices; 30 fF; 94 GHz; EHF; air bridge; metal bonding pads; millimeter-wave mixer diodes; pad capacitance; Anodes; Atherosclerosis; Bonding; Bridge circuits; Capacitance measurement; Contact resistance; Fingers; Gallium arsenide; Millimeter wave technology; Schottky diodes;
fLanguage
English
Journal_Title
Microwave and Guided Wave Letters, IEEE
Publisher
ieee
ISSN
1051-8207
Type
jour
DOI
10.1109/75.143401
Filename
143401
Link To Document