• DocumentCode
    822258
  • Title

    Experimental study of airflow and particle characteristics of a 300-mm POUP/LPU minienvironment system

  • Author

    Hu, Shih-Cheng ; Wu, Tzong-Ming

  • Author_Institution
    Dept. of Air-Conditioning & Refrigeration Eng., Nat. Taipei Univ. of Technol., Taiwan
  • Volume
    16
  • Issue
    4
  • fYear
    2003
  • Firstpage
    660
  • Lastpage
    667
  • Abstract
    This study examines the airflow and particle characteristics of a front opening unified pod/load port unit (FOUP/LPU) minienvironment system. The airflow and particle number were measured by using a three-dimensional ultrasonic anemometer and an He-Ne laser airborne particle counter, respectively. A large vortex is produced below an extracted wafer in the minienvironment. This vortex extends to the lower part of the minienvironment and reaches the door opener of the LPU. Particles produced on the moving parts of the LPU were carried to the back surface of the wafer, which were at the lowest position (the first wafer). How the open ratio of the perforated plate of the minienvironment affects the pressure difference between the minienvironment and surrounding environment and the airflow through the minienvironment was determined. The thoroughly elucidated information is useful for mitigating contamination when planning a fabrication line and designing a production tool.
  • Keywords
    clean rooms; integrated circuit manufacture; semiconductor process modelling; turbulence; vortices; 300 mm; POUP/LPU minienvironment system; airflow characteristics; airflow patterns; contamination control; cost-effective wafer docking; fabrication line planning; front opening unified pod/load port unit; large vortex; laser airborne particle counting; particle characteristics; pressure difference; production tool design; three-dimensional ultrasonic anemometry; Contamination; Counting circuits; Fabrication; Fluid flow measurement; Manufacturing industries; Particle measurements; Pollution measurement; Production planning; Semiconductor device manufacture; Ultrasonic variables measurement;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2003.818957
  • Filename
    1243980