DocumentCode :
822258
Title :
Experimental study of airflow and particle characteristics of a 300-mm POUP/LPU minienvironment system
Author :
Hu, Shih-Cheng ; Wu, Tzong-Ming
Author_Institution :
Dept. of Air-Conditioning & Refrigeration Eng., Nat. Taipei Univ. of Technol., Taiwan
Volume :
16
Issue :
4
fYear :
2003
Firstpage :
660
Lastpage :
667
Abstract :
This study examines the airflow and particle characteristics of a front opening unified pod/load port unit (FOUP/LPU) minienvironment system. The airflow and particle number were measured by using a three-dimensional ultrasonic anemometer and an He-Ne laser airborne particle counter, respectively. A large vortex is produced below an extracted wafer in the minienvironment. This vortex extends to the lower part of the minienvironment and reaches the door opener of the LPU. Particles produced on the moving parts of the LPU were carried to the back surface of the wafer, which were at the lowest position (the first wafer). How the open ratio of the perforated plate of the minienvironment affects the pressure difference between the minienvironment and surrounding environment and the airflow through the minienvironment was determined. The thoroughly elucidated information is useful for mitigating contamination when planning a fabrication line and designing a production tool.
Keywords :
clean rooms; integrated circuit manufacture; semiconductor process modelling; turbulence; vortices; 300 mm; POUP/LPU minienvironment system; airflow characteristics; airflow patterns; contamination control; cost-effective wafer docking; fabrication line planning; front opening unified pod/load port unit; large vortex; laser airborne particle counting; particle characteristics; pressure difference; production tool design; three-dimensional ultrasonic anemometry; Contamination; Counting circuits; Fabrication; Fluid flow measurement; Manufacturing industries; Particle measurements; Pollution measurement; Production planning; Semiconductor device manufacture; Ultrasonic variables measurement;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2003.818957
Filename :
1243980
Link To Document :
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