Static analysis of the die picking process

Author

Lin, Yeong-Jyh ; Hwang, Sheng-Jye

Author_Institution

Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

Volume

28

Issue

2

fYear

2005

fDate

4/1/2005 12:00:00 AM

Firstpage

142

Lastpage

149

Abstract

A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.

Keywords

III-V semiconductors; Taguchi methods; gallium arsenide; integrated circuit bonding; microassembling; GaAs; Taguchi method; die bonder; die breakage; die picking process; finite-element method; manufacture process working-window; needle ejecting speed; pickup collet; pickup machines; pickup process; static analysis; vacuum pressure; Bonding; Finite element methods; Gallium arsenide; MMICs; Manufacturing processes; Microassembly; Needles; Pressing; Production; Surface cracks; Die bonder; Taguchi method; finite-element method; pickup process;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.2005.847396

Filename

1435552