Substrate conduction mechanisms in convectively cooled simulated electronic packages

Author

Ortega, Alfonso ; Kabir, Humayun

Author_Institution

Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA

Volume

15

Issue

5

fYear

1992

fDate

10/1/1992 12:00:00 AM

Firstpage

771

Lastpage

777

Abstract

An analytical model is developed for the conduction from a heated surface element to a conductive substrate or board. The interaction from neighboring components on the board is modeled by modifying the upper board surface temperature. A linear superposition technique is used to demonstrate that the base solution for an isolated component may be used to predict board-level behavior by modification of the driving temperature difference for board conduction. By comparison of the model with data for an array of 1.27-cm cubical elements on a mildly conducting substrate, it is shown that the use of the measured element´s adiabatic temperature as a descriptor of the board temperature allows successful correlation of both single element and surrounded element conduction heat transfer with two geometric parameters

Keywords

convection; cooling; packaging; 1.27 cm; air cooling; analytical model; board-level behavior; conducting substrate; conduction heat transfer; conductive substrate; convective cooling; cubical elements; driving temperature difference; heated surface element; linear superposition technique; simulated electronic packages; substrate conduction mechanisms; Analytical models; Electronic packaging thermal management; Electronics packaging; Heat transfer; Resistance heating; Samarium; Substrates; Surface resistance; Temperature measurement; Thermal resistance;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.180042

Filename

180042