Compact liquid cooling system for small, moveable electronic equipment

Author

Lee, T. Y Tom ; Andrews, James A. ; Chow, Peter ; Saums, David

Author_Institution

Motorola Inc., Phoenix, AZ, USA

Volume

15

Issue

5

fYear

1992

fDate

10/1/1992 12:00:00 AM

Firstpage

786

Lastpage

793

Abstract

The evaluation of a compact liquid cooling system is provided as a benchmark of self-contained heat exchanger units that can be used in small movable electronic equipment. The sealed system contains a fluid expansion chamber, a liquid-to-air heat exchanger core, a fan, and a pump that connects to a multichip module (MCM) package through a pair of flexible stainless steel hoses. Temperatures were recorded as a function of pressure, package power dissipation, and flow rate. The 5.5-L system can remove up to 274 W of power with a 52°C temperature drop from inlet liquid to air for a thermal resistance of 0. 19°C/W while pumping perfluorocarbon FC-72 at a flow rate of 1.1 L/min. Design criteria and improvements for a second generation system are proposed

Keywords

cooling; design engineering; multichip modules; packaging; 274 W; FC-72; MCM; benchmark; compact liquid cooling system; evaluation; fan; flexible stainless steel hoses; flow rate; fluid expansion chamber; improvements; liquid-to-air heat exchanger core; multichip module; package power dissipation; perfluorocarbon; power; pump; sealed system; self-contained heat exchanger; small movable electronic equipment; temperature drop; thermal resistance; Electronic equipment; Electronic packaging thermal management; Heat pumps; Hoses; Liquid cooling; Multichip modules; Packaging machines; Steel; Temperature; Thermal resistance;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.180044

Filename

180044