Title :
Interconnect technologies and the thermal performance of MCM
Author_Institution :
Texas Instruments, Dallas, TX, USA
fDate :
10/1/1992 12:00:00 AM
Abstract :
The thermal performances of multichip modules (MCMs) are compared on the basis of their interconnection technologies. The comparisons are made for hermetic and conduction cooled use environments. The thermal performances of the chip-first-type high density interconnect (HDI) technology, the flipped chip (FCP) technology, and the flipped tape automated bond (FTAB) technology are analyzed and compared for the MCM applications. The results show the thermal performance of each interconnect technology and the most effective ways of improving the performance of MCMs
Keywords :
cooling; digital simulation; finite element analysis; flip-chip devices; multichip modules; packaging; tape automated bonding; FCP; FTAB; HDI; MCM; finite element analysis; flipped chip; flipped tape automated bond; high density interconnect; interconnection technologies; multichip modules; thermal performance; Composite materials; Dielectric materials; Dielectric substrates; Multichip modules; Packaging; Performance analysis; Thermal conductivity; Thermal expansion; Thermal factors; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
