• DocumentCode
    825560
  • Title

    A New Sub-Millimeter Wave Power Amplifier Topology Using Large Transistors

  • Author

    Deal, W.R. ; Mei, X.B. ; Radisic, V. ; Bayuk, B. ; Fung, A. ; Yoshida, W. ; Liu, P.H. ; Uyeda, J. ; Samoska, L. ; Gaier, T. ; Lai, R.

  • Author_Institution
    Northrop Grumman Corp., Redondo Beach, CA
  • Volume
    18
  • Issue
    8
  • fYear
    2008
  • Firstpage
    542
  • Lastpage
    544
  • Abstract
    In this letter, a new power amplifier topology is demonstrated which allows the use of large (120 mum/transistors) at extremely high frequency. This is accomplished by using compact matching networks consisting of coplanar waveguide transmission lines and metal-insulator-metal capacitors to match each of the three amplifier stages. The resulting amplifier achieves a peak gain of 16.5 dB at 260 GHz. Power measurements indicate that the chip achieves >5.9 mW (unsaturated) of output power and 4% power added efficiency at a frequency of 270 GHz, where the output power is limited by the available source drive power. This power level from a single transistor represents a significant improvement at this frequency band.
  • Keywords
    coplanar waveguides; millimetre wave amplifiers; coplanar waveguide transmission lines; metal-insulator-metal capacitors; sub-millimeter wave power amplifier; Coplanar transmission lines; Coplanar waveguides; Frequency; Gain; High power amplifiers; MIM capacitors; Network topology; Power amplifiers; Power generation; Power transmission lines; Coplanar waveguide (CPW); high electron mobility transistor (HEMT); millimeter wave; monolithic microwave integrated circuit (MMIC); power amplifier (PA);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2008.2001017
  • Filename
    4588994