• DocumentCode
    825880
  • Title

    On test [electronic device testing]

  • Author

    Deaves, Matthew

  • Volume
    82
  • Issue
    5
  • fYear
    2003
  • Firstpage
    40
  • Lastpage
    43
  • Abstract
    With electronic devices and components getting smaller and smaller, accurate, reliable test systems are becoming more of a challenge that designers must take seriously. 2 methods are described. Electrical testing is technically very difficult to set up, but devices that have been designed to Joint Test Action Group (JTAG) standards are provided with a boundary scan description language (BDSL) file, which gives test engineers a head start. SPEAs solution is a flying probe hybrid test platform that also has AOI functionality This provides benefits to users in a number of ways. Manufacturers no longer have to choose between investing in flying probe or AOI, as they can be afforded economical access to both methods.
  • Keywords
    automatic optical inspection; automatic test equipment; electronic engineering computing; integrated circuit testing; printed circuit testing; production testing; specification languages; standards; AOI; BDSL file; JTAG standards; Joint Test Action Group standards; SPEA; boundary scan description language file; electronic components; electronic device testing; flying probe hybrid test platform;
  • fLanguage
    English
  • Journal_Title
    Manufacturing Engineer
  • Publisher
    iet
  • ISSN
    0956-9944
  • Type

    jour

  • DOI
    10.1049/me:20030508
  • Filename
    1245156