Characterizations of Cu/Sn–Zn Solder/Ag Interfaces on Photovoltaic Ribbon for Silicon Solar Cells

Author

Kuan-Jen Chen ; Fei-Yi Hung ; Truan-Sheng Lui ; Li-Hui Chen ; Yu-Wen Chen

Author_Institution

Instrum. Center, Nat. Cheng Kung Univ., Tainan, Taiwan

Volume

5

Issue

1

fYear

2015

fDate

Jan. 2015

Firstpage

202

Lastpage

205

Abstract

Sn-xZn (x = 9, 25, and 50 wt%) alloy solders are applied in photovoltaic (PV) ribbon and connected with silicon solar cells. The interfacial microstructures, series resistance, and bonding strength of Sn-xZn PV modules are investigated. Cu₅Zn₈ and AgZn₃ intermetallic compounds (IMCs) were found at the interfaces. The Zn content in the solder dominates the growth behavior of IMCs at the interface. The thickness of the Cu₅Zn₈ and AgZn₃ IMC layer increased with increasing Zn content in the solder, and thus, the series resistance of the PV module also increased. The growth of IMCs can enhance the interfacial adhesion strength, but excess Zn overconsumes the Ag electrode, reducing the bond strength of the PV module. Applying low-Zn-content Sn- xZn solder to PV ribbon avoids overconsumption of the Ag layer and, thus, decreases the series resistance and internal stress.

Keywords

adhesion; copper; crystal microstructure; electrical resistivity; elemental semiconductors; interface structure; internal stresses; silicon; silver; solar cells; solders; tin alloys; zinc alloys; Cu-SnZn-Ag-Si; PV modules; alloy solders; bonding strength; electrode; interfacial adhesion strength; interfacial microstructure; intermetallic compound layer thickness; internal stress; photovoltaic ribbon; series resistance; silicon solar cells; Electrodes; Microstructure; Photovoltaic cells; Photovoltaic systems; Resistance; Zinc; Bonding strength; Sn-xZn solder; intermetallic compounds (IMCs); internal stress; photovoltaic (PV) ribbon;

fLanguage

English

Journal_Title

Photovoltaics, IEEE Journal of

Publisher

ieee

ISSN

2156-3381

Type

jour

DOI

10.1109/JPHOTOV.2014.2373822

Filename

6979227