• DocumentCode
    829338
  • Title

    Proper Orthogonal Decomposition in the Generation of Reduced Order Models for Interconnects

  • Author

    Lin, Wu Zhong ; Zhang, Yao Jiang ; Li, Er Ping

  • Author_Institution
    Data Storage Inst., Singapore
  • Volume
    31
  • Issue
    3
  • fYear
    2008
  • Firstpage
    627
  • Lastpage
    636
  • Abstract
    In this paper, reduced order models are generated using the technique of proper orthogonal decomposition (POD), also known as Karhunen-Loeve decomposition (KLD) for the simulations of interconnect problems. Model order reduction is achieved by projecting the state-space of the original problems onto a subspace spanned by a few number of proper orthogonal modes (POMs) extracted by the POD procedure from an ensemble of system responses at a series of selected frequencies. The proper orthogonal values (POVs) corresponding to the POMs indicate the level of the importance of each POM and provide a guidance for the number of POMs to be used in the reduced order models in order to have enough accuracy. Numerical experiment results obtained from the simulations of a two-conductor interconnect and a spiral inductor demonstrate that the reduced order models generated in this way can simulate the original system more effectively and faithfully than those generated with the standard Krylov subspace method with moment matching at a single point.
  • Keywords
    integrated circuit interconnections; Karhunen-Loeve decomposition; Krylov subspace method; packaging; proper orthogonal decomposition; two-conductor interconnect; Electromagnetic coupling; Electromagnetic modeling; Electromagnetic radiation; Electronics packaging; Erbium; Frequency; High performance computing; Integrated circuit interconnections; Reduced order systems; State-space methods; Interconnect; Karhunen-LoÈve decomposition (KLD); model order reduction; proper orthogonal decomposition (POD);
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2008.927820
  • Filename
    4591488