Title :
Precision poly-(dimethyl siloxane) masking technology for high-resolution powder blasting
Author :
Pawlowski, Anne-Gabrielle ; Sayah, Abdeljalil ; Gijs, Martin A M
Author_Institution :
Inst. of Microelectron. & Microsysterns, Swiss Fed. Inst. of Technol., Lausanne, Switzerland
fDate :
6/1/2005 12:00:00 AM
Abstract :
Powder blasting micro-erosion is a fast and flexible technique for the micropatterning of brittle materials. We have combined 10 μm diameter Al2O3 eroding particles with a new masking technique to realize the smallest possible structures with the powder blasting process (30 μm). Our masking technology is based on the sequential combination of two polymers: 1) the brittle epoxy resin SU8 for its photosensitivity and 2) the elastic and thermo-curable poly-(dimethyl siloxane) (PDMS) for its large erosion resistance. We have micropatterned glass microstructures with aspect ratio 1 and structural details down to 20 μm. We compare the mask size-dependent etching rate using both 1.0 and 30 jam diameter Al2O3 particles and find a decreasing etching rate for structures that are smaller than about 10 times the particle size. Combining SU8 with PDMS proves to be a very easy and accurate masking technology that allows exploring the fundamental dimensional limits of the powder blasting micro-erosion process.
Keywords :
brittleness; etching; masks; polymers; powder technology; Al2O3; PDMS; SU8 brittle epoxy resin; brittle materials; eroding particles; erosion resistance; glass microstructures; high-resolution powder blasting; mask size-dependent etching rate; masking technique; micropatterning; photosensitivity; polymers; powder blasting micro-erosion; precision poly-(dimethyl siloxane) masking technology; thermo-curable poly-(dimethyl siloxane); Epoxy resins; Glass; Helium; Kinetic energy; Microstructure; Particle beams; Polymers; Powders; Thermal resistance; Wet etching; Glass; high-resolution; masking technology; poly-(dimethyl siloxane) (PDMS); powder blasting;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2005.844745